IBM·삼성, 반도체 '트랜지스터' 기반의 새로운 칩 공정 제시

IBM and Samsung have announced a new way to stack transistors on a chip. The new Vertical Transport Field Effect Transistors (VTFET) design is meant to succeed the current FinFET technology. The two companies claim VTFET chips could offer a “two times improvement in performance or an 85 percent reduction in energy use”

IBM and Samsung say their new chip design could lead to week-long battery life on phones

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